Nvidia Nears $20 Billion OpenAI Investment as AI Funding Race Intensifies 
Instagram Outage Disrupts Thousands of U.S. Users 
Anthropic Eyes $350 Billion Valuation as AI Funding and Share Sale Accelerate 
FDA Targets Hims & Hers Over $49 Weight-Loss Pill, Raising Legal and Safety Concerns 
Nintendo Shares Slide After Earnings Miss Raises Switch 2 Margin Concerns 
Missouri Judge Dismisses Lawsuit Challenging Starbucks’ Diversity and Inclusion Policies 
Uber Ordered to Pay $8.5 Million in Bellwether Sexual Assault Lawsuit 
TSMC Eyes 3nm Chip Production in Japan with $17 Billion Kumamoto Investment 
Australian Scandium Project Backed by Richard Friedland Poised to Support U.S. Critical Minerals Stockpile 
CK Hutchison Launches Arbitration After Panama Court Revokes Canal Port Licences 
Prudential Financial Reports Higher Q4 Profit on Strong Underwriting and Investment Gains 
Toyota’s Surprise CEO Change Signals Strategic Shift Amid Global Auto Turmoil 
Once Upon a Farm Raises Nearly $198 Million in IPO, Valued at Over $724 Million 
Alphabet’s Massive AI Spending Surge Signals Confidence in Google’s Growth Engine 
AMD Shares Slide Despite Earnings Beat as Cautious Revenue Outlook Weighs on Stock 
OpenAI Expands Enterprise AI Strategy With Major Hiring Push Ahead of New Business Offering 
Nvidia CEO Jensen Huang Says AI Investment Boom Is Just Beginning as NVDA Shares Surge 
PORTLAND, Ore., Jan. 06, 2017 -- Electro Scientific Industries, Inc. (Nasdaq:ESIO), an innovator in laser-based manufacturing solutions for the micro-machining industry, highlighted its new low-cost RedStone™ PCB laser processing system at the Hong Kong Printed Circuit Association’s (HKPCA) trade show in Shenzhen, China, December 7-9. ESI’s nViant™ solution for HDI PCB manufacturing was also highlighted.
The RedStone system is ESI’s latest addition to its market-leading portfolio of flexible PCB laser processing solutions, and is engineered to cost-effectively address a specific range of applications and processing capabilities. For FPC manufacturers considering the adoption of laser processing for flex PCB, RedStone provides a capable low cost-of-entry solution to supplement their mechanical drilling capabilities, and enables them to offer an additional set of production-oriented laser processing services. For those who have already integrated flexible PCB laser processing into their production flow, RedStone offers optimized production targeting specific applications, such as through-via drilling and through-cut routing.
“RedStone is designed, first and foremost, around optimizing production for flex PCB processors,” stated Mike Jennings, Director of Product Marketing for ESI’s Flex Products Division. “For customers looking to gain application-specific processing efficiencies through pairing the right tool to the right job, or the addition of a laser processing option, RedStone is the right tool. It rounds-out our portfolio of FPC solutions, as a versatile platform offered at an entry level of affordability, and it was a popular topic with attendees at the show.”
RedStone delivers an optimal combination of laser type and laser control capabilities to address the processing of basic applications requiring extra power or more repetitions to ensure that the process is robust and delivers high yield. It extends the breadth of a solutions portfolio that already includes the industry’s most popular line of flex PCB processing systems, a CO2-laser-based processing system for affordable HDI PCB manufacturing, and high-volume low cost-of-ownership solutions for IC packaging.
Early market adoption of the RedStone system has already been promising, with initial system orders placed with Asia-based customers.
RedStone is available through ESI directly, as well as through ESI channel partners.
About ESI, Inc.
ESI's integrated solutions allow industrial designers and process engineers to control the power of laser light to transform materials in ways that differentiate their consumer electronics, wearable devices, semiconductor circuits and high-precision components for market advantage. ESI's laser-based manufacturing solutions feature the micro-machining industry's highest precision and speed, and target the lowest total cost of ownership. ESI is headquartered in Portland, Ore., with global operations from the Pacific Northwest to the Pacific Rim. More information is available at www.esi.com.
Brian Smith Director of Investor Relations [email protected] 503-672-5760
